COVID-19 Impact on Global Semiconductor Packaging Service Market Size, Status and Forecast 2020-2026

Published On: Jul 2020

Format: PDF

Publisher: QY Research

Pages: 154

Report ID: 199168

This report focuses on the global Semiconductor Packaging Service status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Semiconductor Packaging Service development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.

The key players covered in this study
SPIL
ASE
TFME
TSMC
Nepes
Unisem
JCET
IMEC
UTAC
eSilicon
Huatian
Chipbond
Chipmos
Formosa
Carsem
J-Devices
Stats Chippac
Amkor Technology
Lingsen Precision
MegaChips Technology
Powertech Technology
Integra Technologies
China Wafer Level CSP
King Yuan Electronics
Advanced Micro Devices
Walton Advanced Engineering
Tianshui Huatian Technology
Siliconware Precision Industries

Market segment by Type, the product can be split into
Wafer Level Packages
System in Package (SiP)
Others
Market segment by Application, split into
Commercial Use
Military Use

Market segment by Regions/Countries, this report covers
North America
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global Semiconductor Packaging Service status, future forecast, growth opportunity, key market and key players.
To present the Semiconductor Packaging Service development in North America, Europe, China, Japan, Southeast Asia, India and Central & South America.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by type, market and key regions.

In this study, the years considered to estimate the market size of Semiconductor Packaging Service are as follows:
History Year: 2015-2019
Base Year: 2019
Estimated Year: 2020
Forecast Year 2020 to 2026
For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered: Ranking by Semiconductor Packaging Service Revenue
1.4 Market Analysis by Type
1.4.1 Global Semiconductor Packaging Service Market Size Growth Rate by Type: 2020 VS 2026
1.4.2 Wafer Level Packages
1.4.3 System in Package (SiP)
1.4.4 Others
1.5 Market by Application
1.5.1 Global Semiconductor Packaging Service Market Share by Application: 2020 VS 2026
1.5.2 Commercial Use
1.5.3 Military Use
1.6 Coronavirus Disease 2019 (Covid-19): Semiconductor Packaging Service Industry Impact
1.6.1 How the Covid-19 is Affecting the Semiconductor Packaging Service Industry
1.6.1.1 Semiconductor Packaging Service Business Impact Assessment - Covid-19
1.6.1.2 Supply Chain Challenges
1.6.1.3 COVID-19’s Impact On Crude Oil and Refined Products
1.6.2 Market Trends and Semiconductor Packaging Service Potential Opportunities in the COVID-19 Landscape
1.6.3 Measures / Proposal against Covid-19
1.6.3.1 Government Measures to Combat Covid-19 Impact
1.6.3.2 Proposal for Semiconductor Packaging Service Players to Combat Covid-19 Impact
1.7 Study Objectives
1.8 Years Considered

2 Global Growth Trends by Regions
2.1 Semiconductor Packaging Service Market Perspective (2015-2026)
2.2 Semiconductor Packaging Service Growth Trends by Regions
2.2.1 Semiconductor Packaging Service Market Size by Regions: 2015 VS 2020 VS 2026
2.2.2 Semiconductor Packaging Service Historic Market Share by Regions (2015-2020)
2.2.3 Semiconductor Packaging Service Forecasted Market Size by Regions (2021-2026)
2.3 Industry Trends and Growth Strategy
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Challenges
2.3.4 Porter’s Five Forces Analysis
2.3.5 Semiconductor Packaging Service Market Growth Strategy
2.3.6 Primary Interviews with Key Semiconductor Packaging Service Players (Opinion Leaders)

3 Competition Landscape by Key Players
3.1 Global Top Semiconductor Packaging Service Players by Market Size
3.1.1 Global Top Semiconductor Packaging Service Players by Revenue (2015-2020)
3.1.2 Global Semiconductor Packaging Service Revenue Market Share by Players (2015-2020)
3.1.3 Global Semiconductor Packaging Service Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
3.2 Global Semiconductor Packaging Service Market Concentration Ratio
3.2.1 Global Semiconductor Packaging Service Market Concentration Ratio (CR5 and HHI)
3.2.2 Global Top 10 and Top 5 Companies by Semiconductor Packaging Service Revenue in 2019
3.3 Semiconductor Packaging Service Key Players Head office and Area Served
3.4 Key Players Semiconductor Packaging Service Product Solution and Service
3.5 Date of Enter into Semiconductor Packaging Service Market
3.6 Mergers & Acquisitions, Expansion Plans

4 Breakdown Data by Type (2015-2026)
4.1 Global Semiconductor Packaging Service Historic Market Size by Type (2015-2020)
4.2 Global Semiconductor Packaging Service Forecasted Market Size by Type (2021-2026)

5 Semiconductor Packaging Service Breakdown Data by Application (2015-2026)
5.1 Global Semiconductor Packaging Service Market Size by Application (2015-2020)
5.2 Global Semiconductor Packaging Service Forecasted Market Size by Application (2021-2026)

6 North America
6.1 North America Semiconductor Packaging Service Market Size (2015-2020)
6.2 Semiconductor Packaging Service Key Players in North America (2019-2020)
6.3 North America Semiconductor Packaging Service Market Size by Type (2015-2020)
6.4 North America Semiconductor Packaging Service Market Size by Application (2015-2020)

7 Europe
7.1 Europe Semiconductor Packaging Service Market Size (2015-2020)
7.2 Semiconductor Packaging Service Key Players in Europe (2019-2020)
7.3 Europe Semiconductor Packaging Service Market Size by Type (2015-2020)
7.4 Europe Semiconductor Packaging Service Market Size by Application (2015-2020)

8 China
8.1 China Semiconductor Packaging Service Market Size (2015-2020)
8.2 Semiconductor Packaging Service Key Players in China (2019-2020)
8.3 China Semiconductor Packaging Service Market Size by Type (2015-2020)
8.4 China Semiconductor Packaging Service Market Size by Application (2015-2020)

9 Japan
9.1 Japan Semiconductor Packaging Service Market Size (2015-2020)
9.2 Semiconductor Packaging Service Key Players in Japan (2019-2020)
9.3 Japan Semiconductor Packaging Service Market Size by Type (2015-2020)
9.4 Japan Semiconductor Packaging Service Market Size by Application (2015-2020)

10 Southeast Asia
10.1 Southeast Asia Semiconductor Packaging Service Market Size (2015-2020)
10.2 Semiconductor Packaging Service Key Players in Southeast Asia (2019-2020)
10.3 Southeast Asia Semiconductor Packaging Service Market Size by Type (2015-2020)
10.4 Southeast Asia Semiconductor Packaging Service Market Size by Application (2015-2020)

11 India
11.1 India Semiconductor Packaging Service Market Size (2015-2020)
11.2 Semiconductor Packaging Service Key Players in India (2019-2020)
11.3 India Semiconductor Packaging Service Market Size by Type (2015-2020)
11.4 India Semiconductor Packaging Service Market Size by Application (2015-2020)

12 Central & South America
12.1 Central & South America Semiconductor Packaging Service Market Size (2015-2020)
12.2 Semiconductor Packaging Service Key Players in Central & South America (2019-2020)
12.3 Central & South America Semiconductor Packaging Service Market Size by Type (2015-2020)
12.4 Central & South America Semiconductor Packaging Service Market Size by Application (2015-2020)

13 Key Players Profiles
13.1 SPIL
13.1.1 SPIL Company Details
13.1.2 SPIL Business Overview and Its Total Revenue
13.1.3 SPIL Semiconductor Packaging Service Introduction
13.1.4 SPIL Revenue in Semiconductor Packaging Service Business (2015-2020))
13.1.5 SPIL Recent Development
13.2 ASE
13.2.1 ASE Company Details
13.2.2 ASE Business Overview and Its Total Revenue
13.2.3 ASE Semiconductor Packaging Service Introduction
13.2.4 ASE Revenue in Semiconductor Packaging Service Business (2015-2020)
13.2.5 ASE Recent Development
13.3 TFME
13.3.1 TFME Company Details
13.3.2 TFME Business Overview and Its Total Revenue
13.3.3 TFME Semiconductor Packaging Service Introduction
13.3.4 TFME Revenue in Semiconductor Packaging Service Business (2015-2020)
13.3.5 TFME Recent Development
13.4 TSMC
13.4.1 TSMC Company Details
13.4.2 TSMC Business Overview and Its Total Revenue
13.4.3 TSMC Semiconductor Packaging Service Introduction
13.4.4 TSMC Revenue in Semiconductor Packaging Service Business (2015-2020)
13.4.5 TSMC Recent Development
13.5 Nepes
13.5.1 Nepes Company Details
13.5.2 Nepes Business Overview and Its Total Revenue
13.5.3 Nepes Semiconductor Packaging Service Introduction
13.5.4 Nepes Revenue in Semiconductor Packaging Service Business (2015-2020)
13.5.5 Nepes Recent Development
13.6 Unisem
13.6.1 Unisem Company Details
13.6.2 Unisem Business Overview and Its Total Revenue
13.6.3 Unisem Semiconductor Packaging Service Introduction
13.6.4 Unisem Revenue in Semiconductor Packaging Service Business (2015-2020)
13.6.5 Unisem Recent Development
13.7 JCET
13.7.1 JCET Company Details
13.7.2 JCET Business Overview and Its Total Revenue
13.7.3 JCET Semiconductor Packaging Service Introduction
13.7.4 JCET Revenue in Semiconductor Packaging Service Business (2015-2020)
13.7.5 JCET Recent Development
13.8 IMEC
13.8.1 IMEC Company Details
13.8.2 IMEC Business Overview and Its Total Revenue
13.8.3 IMEC Semiconductor Packaging Service Introduction
13.8.4 IMEC Revenue in Semiconductor Packaging Service Business (2015-2020)
13.8.5 IMEC Recent Development
13.9 UTAC
13.9.1 UTAC Company Details
13.9.2 UTAC Business Overview and Its Total Revenue
13.9.3 UTAC Semiconductor Packaging Service Introduction
13.9.4 UTAC Revenue in Semiconductor Packaging Service Business (2015-2020)
13.9.5 UTAC Recent Development
13.10 eSilicon
13.10.1 eSilicon Company Details
13.10.2 eSilicon Business Overview and Its Total Revenue
13.10.3 eSilicon Semiconductor Packaging Service Introduction
13.10.4 eSilicon Revenue in Semiconductor Packaging Service Business (2015-2020)
13.10.5 eSilicon Recent Development
13.11 Huatian
10.11.1 Huatian Company Details
10.11.2 Huatian Business Overview and Its Total Revenue
10.11.3 Huatian Semiconductor Packaging Service Introduction
10.11.4 Huatian Revenue in Semiconductor Packaging Service Business (2015-2020)
10.11.5 Huatian Recent Development
13.12 Chipbond
10.12.1 Chipbond Company Details
10.12.2 Chipbond Business Overview and Its Total Revenue
10.12.3 Chipbond Semiconductor Packaging Service Introduction
10.12.4 Chipbond Revenue in Semiconductor Packaging Service Business (2015-2020)
10.12.5 Chipbond Recent Development
13.13 Chipmos
10.13.1 Chipmos Company Details
10.13.2 Chipmos Business Overview and Its Total Revenue
10.13.3 Chipmos Semiconductor Packaging Service Introduction
10.13.4 Chipmos Revenue in Semiconductor Packaging Service Business (2015-2020)
10.13.5 Chipmos Recent Development
13.14 Formosa
10.14.1 Formosa Company Details
10.14.2 Formosa Business Overview and Its Total Revenue
10.14.3 Formosa Semiconductor Packaging Service Introduction
10.14.4 Formosa Revenue in Semiconductor Packaging Service Business (2015-2020)
10.14.5 Formosa Recent Development
13.15 Carsem
10.15.1 Carsem Company Details
10.15.2 Carsem Business Overview and Its Total Revenue
10.15.3 Carsem Semiconductor Packaging Service Introduction
10.15.4 Carsem Revenue in Semiconductor Packaging Service Business (2015-2020)
10.15.5 Carsem Recent Development
13.16 J-Devices
10.16.1 J-Devices Company Details
10.16.2 J-Devices Business Overview and Its Total Revenue
10.16.3 J-Devices Semiconductor Packaging Service Introduction
10.16.4 J-Devices Revenue in Semiconductor Packaging Service Business (2015-2020)
10.16.5 J-Devices Recent Development
13.17 Stats Chippac
10.17.1 Stats Chippac Company Details
10.17.2 Stats Chippac Business Overview and Its Total Revenue
10.17.3 Stats Chippac Semiconductor Packaging Service Introduction
10.17.4 Stats Chippac Revenue in Semiconductor Packaging Service Business (2015-2020)
10.17.5 Stats Chippac Recent Development
13.18 Amkor Technology
10.18.1 Amkor Technology Company Details
10.18.2 Amkor Technology Business Overview and Its Total Revenue
10.18.3 Amkor Technology Semiconductor Packaging Service Introduction
10.18.4 Amkor Technology Revenue in Semiconductor Packaging Service Business (2015-2020)
10.18.5 Amkor Technology Recent Development
13.19 Lingsen Precision
10.19.1 Lingsen Precision Company Details
10.19.2 Lingsen Precision Business Overview and Its Total Revenue
10.19.3 Lingsen Precision Semiconductor Packaging Service Introduction
10.19.4 Lingsen Precision Revenue in Semiconductor Packaging Service Business (2015-2020)
10.19.5 Lingsen Precision Recent Development
13.20 MegaChips Technology
10.20.1 MegaChips Technology Company Details
10.20.2 MegaChips Technology Business Overview and Its Total Revenue
10.20.3 MegaChips Technology Semiconductor Packaging Service Introduction
10.20.4 MegaChips Technology Revenue in Semiconductor Packaging Service Business (2015-2020)
10.20.5 MegaChips Technology Recent Development
13.21 Powertech Technology
10.21.1 Powertech Technology Company Details
10.21.2 Powertech Technology Business Overview and Its Total Revenue
10.21.3 Powertech Technology Semiconductor Packaging Service Introduction
10.21.4 Powertech Technology Revenue in Semiconductor Packaging Service Business (2015-2020)
10.21.5 Powertech Technology Recent Development
13.22 Integra Technologies
10.22.1 Integra Technologies Company Details
10.22.2 Integra Technologies Business Overview and Its Total Revenue
10.22.3 Integra Technologies Semiconductor Packaging Service Introduction
10.22.4 Integra Technologies Revenue in Semiconductor Packaging Service Business (2015-2020)
10.22.5 Integra Technologies Recent Development
13.23 China Wafer Level CSP
10.23.1 China Wafer Level CSP Company Details
10.23.2 China Wafer Level CSP Business Overview and Its Total Revenue
10.23.3 China Wafer Level CSP Semiconductor Packaging Service Introduction
10.23.4 China Wafer Level CSP Revenue in Semiconductor Packaging Service Business (2015-2020)
10.23.5 China Wafer Level CSP Recent Development
13.24 King Yuan Electronics
10.24.1 King Yuan Electronics Company Details
10.24.2 King Yuan Electronics Business Overview and Its Total Revenue
10.24.3 King Yuan Electronics Semiconductor Packaging Service Introduction
10.24.4 King Yuan Electronics Revenue in Semiconductor Packaging Service Business (2015-2020)
10.24.5 King Yuan Electronics Recent Development
13.25 Advanced Micro Devices
10.25.1 Advanced Micro Devices Company Details
10.25.2 Advanced Micro Devices Business Overview and Its Total Revenue
10.25.3 Advanced Micro Devices Semiconductor Packaging Service Introduction
10.25.4 Advanced Micro Devices Revenue in Semiconductor Packaging Service Business (2015-2020)
10.25.5 Advanced Micro Devices Recent Development
13.26 Walton Advanced Engineering
10.26.1 Walton Advanced Engineering Company Details
10.26.2 Walton Advanced Engineering Business Overview and Its Total Revenue
10.26.3 Walton Advanced Engineering Semiconductor Packaging Service Introduction
10.26.4 Walton Advanced Engineering Revenue in Semiconductor Packaging Service Business (2015-2020)
10.26.5 Walton Advanced Engineering Recent Development
13.27 Tianshui Huatian Technology
10.27.1 Tianshui Huatian Technology Company Details
10.27.2 Tianshui Huatian Technology Business Overview and Its Total Revenue
10.27.3 Tianshui Huatian Technology Semiconductor Packaging Service Introduction
10.27.4 Tianshui Huatian Technology Revenue in Semiconductor Packaging Service Business (2015-2020)
10.27.5 Tianshui Huatian Technology Recent Development
13.28 Siliconware Precision Industries
10.28.1 Siliconware Precision Industries Company Details
10.28.2 Siliconware Precision Industries Business Overview and Its Total Revenue
10.28.3 Siliconware Precision Industries Semiconductor Packaging Service Introduction
10.28.4 Siliconware Precision Industries Revenue in Semiconductor Packaging Service Business (2015-2020)
10.28.5 Siliconware Precision Industries Recent Development

14 Analyst's Viewpoints/Conclusions

15 Appendix
15.1 Research Methodology
15.1.1 Methodology/Research Approach
15.1.2 Data Source
15.2 Disclaimer
15.3 Author Details